Founded in June 2020, Microstone specializes in the research, development, production, and sales of thermal conductive powder materials. We have an advanced R&D center and manufacturing facility in Dazhou, Sichuan, supported by customer service centers in Shanghai and Dongguan, Guangdong.
At Microstone, we have honed our expertise in core technologies such as powder morphology control, particle size optimization, crystal phase transition, powder purification, and surface treatment for thermal conductive powders. Our flagship products include a range of mid-to-high-end thermal conductivity powders, such as spherical alumina, roundish alumina, aluminum nitride, and boron nitride.
Our product offerings find extensive application in thermal interface materials, high-thermal-conductivity copper clad laminates (CCL), and epoxy molding compound (EMC) packaging materials. These materials are widely used in components for automotive electronics, AI hardware, telecommunications, consumer electronics ,and so on.
